DocumentCode
3320027
Title
The effect of growth temperature on the structure of GaSb/GaAs quantum dots grown by MOCVD
Author
Motlan ; Goldys, E.M. ; Tansley, T.L.
Author_Institution
Semicond. Sci. & Technol. Labs., Macquarie Univ., North Ryde, NSW, Australia
fYear
2000
fDate
2000
Firstpage
236
Lastpage
239
Abstract
Dot size and density are important factors that determine the physical properties of semiconductor materials based on arrays of self-assembled dots (SADs). We report the effects of growth temperature on strained GaSb three-dimensional (3D) islands on GaAs grown by metalorganic chemical vapor deposition (MOCVD). In this work we use growth temperatures of 480°C, 500°C, 520°C, and 540°C. The results show decreasing dot widths as growth temperature increases. On the other hand, the dot densities generally increase. We believe that the increase in growth temperature increases adatom diffusion length and consequently leads to more extensive dots. However, fragmentation due to elastic relaxation appears to compensate at higher temperatures. As a result the dot density increases again, while average sizes fall
Keywords
III-V semiconductors; MOCVD; adsorbed layers; arrays; gallium arsenide; gallium compounds; island structure; particle size; self-assembly; semiconductor growth; semiconductor quantum dots; vapour phase epitaxial growth; 480 to 540 C; GaAs; GaSb-GaAs; GaSb/GaAs quantum dots; MOCVD; adatom diffusion length; arrays; density; dot densities; dot size; dot width; elastic relaxation; fragmentation; growth temperature; growth temperatures; metalorganic chemical vapor deposition; self-assembled dots; strained GaSb three-dimensional islands; structure; Atomic force microscopy; Gallium arsenide; Laboratories; MOCVD; Quantum dot lasers; Quantum dots; Scanning electron microscopy; Substrates; Temperature; US Department of Transportation;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconducting and Insulating Materials Conference, 2000. SIMC-XI. International
Conference_Location
Canberra, ACT
Print_ISBN
0-7803-5814-7
Type
conf
DOI
10.1109/SIM.2000.939234
Filename
939234
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