Title :
Failure analysis of BGA package by a TDR approach
Author :
Chen, Ming-Kun ; Tai, Cheng-Chi ; Huang, Yu-Jung ; Wu, I-Chih
Author_Institution :
Dept. of Electr. Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
Abstract :
This paper presents failure analysis (FA) of the electrical interconnection of BGA packaging. The TDR (time domain reflectometry) measurement methodology is increasing in importance as a nondestructive method for fault location in BGA packages. Semiconductor manufacturers use TDR as a failure analysis tool because it can quickly perform nondestructive tests on packaged ICs. The measurement waveform of TDR makes it an easy and accuracy method that can assist with fault location in BGA packages. TDR can isolate open and short-circuit defects in the three main regions of an IC: open and short circuit in the copper tracks in the substrate, bond wire, and solder ball. We analyze in detail the TDR impedance as applicable to electronic BGA packaging fault location, focusing on the comparison of TDR measurement and X-ray modeling fault location.
Keywords :
ball grid arrays; failure analysis; fault location; integrated circuit interconnections; integrated circuit packaging; integrated circuit testing; time-domain reflectometry; BGA package failure analysis; BGA packaging interconnections; TDR impedance; TDR measurement methodology; X-ray modeling fault location; bond wires; fault location; nondestructive fault location; open defects; short-circuit defects; solder balls; substrate copper tracks; time domain reflectometry; Circuit testing; Electronics packaging; Failure analysis; Fault location; Integrated circuit interconnections; Performance evaluation; Reflectometry; Semiconductor device manufacture; Semiconductor device packaging; Time measurement;
Conference_Titel :
Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on
Print_ISBN :
0-7803-7682-X
DOI :
10.1109/EMAP.2002.1188822
