Title :
A study on the adhesion performance of copper to polyimide for microelectronic packaging-flex substrates
Author :
Lin, Yung-Sen ; Liu, Huang-Ming
Author_Institution :
Departments of Mater. Sci. & Eng., I-Shou Univ., Kaohsiung, Taiwan
Abstract :
The objective of this study is to investigate the adhesive strength and the failure modes of Cu to polyimide for the two and three layers of flex substrates. Peel test was applied to measure the interfacial strength of Cu to polyimide and Optical Microscopy (OM), Scanning Electron Microscopy (SEM) and Energy Disperse Spectroscopy (EDS) were used to observe the failure modes. The durability of Cu bonding to polyimide for the two and three layers of flex substrates was also studied by aging at various temperatures from 25°C to 400°C.
Keywords :
X-ray chemical analysis; adhesion; ageing; failure analysis; integrated circuit packaging; optical microscopy; scanning electron microscopy; 25 to 400 degC; Cu; Energy Disperse Spectroscopy; Optical Microscopy; Scanning Electron Microscopy; adhesion performance; adhesive strength; aging; durability; failure modes; interfacial strength; microelectronic packaging-flex substrates; peel test; Adhesive strength; Copper; Electron optics; Energy measurement; Microelectronics; Optical microscopy; Packaging; Polyimides; Scanning electron microscopy; Testing;
Conference_Titel :
Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on
Print_ISBN :
0-7803-7682-X
DOI :
10.1109/EMAP.2002.1188835
