• DocumentCode
    3320390
  • Title

    Research of the temperature at the rake face of cutting tools by using boundary element method

  • Author

    Lin, Jin-Chein ; Liang, P.W.

  • Author_Institution
    Mech. Eng. Dept., Kuang Wu Inst. of Technol., Taipei, Taiwan
  • fYear
    2002
  • fDate
    4-6 Dec. 2002
  • Firstpage
    221
  • Lastpage
    225
  • Abstract
    Cutting temperature is a major factor in controlling tool wear, surface quality, and the chip formation mechanics. It has been recognized as an important study in achieving the best cutting performance to understand the exact temperature rise in the tool-chip interface. Therefore, a good method is presented to estimate the cutting temperature distributions based on the inverse heat transfer theory. The first stage of the analysis is to solve a heat transfer model of the cutting tool with three-dimensional boundary element method. This is a direct heat transfer problem. Furthermore, inverse heat transfer technique of the sequential estimation is employed to simulate the time histories of heat fluxes at the rake face based on the measured temperature responses on the tool measuring point. The stability of the remote sensor technique is shown to be improved by introducing more future time steps. The present model can be used not only to determine the part of heat flux flowing into the cutting tool but also the temperature contours on the tool-chip interface and the history of temperature response.
  • Keywords
    boundary-elements methods; cutting; heat transfer; inverse problems; machine tools; remote sensing; temperature distribution; cutting tool; inverse heat transfer model; rake face; remote sensor; temperature distribution; three-dimensional boundary element method; tool-chip interface; Boundary element methods; Cutting tools; Heat transfer; History; Stability; Temperature control; Temperature distribution; Temperature measurement; Temperature sensors; Time measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on
  • Print_ISBN
    0-7803-7682-X
  • Type

    conf

  • DOI
    10.1109/EMAP.2002.1188841
  • Filename
    1188841