Title :
Predicting Defect-Prone Software Modules at Different Logical Levels
Author :
Huang, Peng ; Zhu, Jie
Author_Institution :
Dept. of Electron. Eng., Shanghai Jiao Tong Univ., Shanghai, China
Abstract :
Effective software defect estimation can bring cost reduction and efficient resources allocation in software development and testing. Usually, estimation of defect-prone modules is based on the supervised learning of the modules at the same logical level. Various practical issues may limit the availability or quality of the attribute-value vectors extracting from the high-level modules by software metrics. In this paper, the problem of estimating the defect in high-level software modules is investigated with a multi-instance learning (MIL) perspective. In detail, each high-level module is regarded as a bag of its low-level components, and the learning task is to estimate the defect-proneness of the bags. Several typical supervised learning and MIL algorithms are evaluated on a mission critical project from NASA. Compared to the selected supervised schemas, the MIL methods improve the performance of the software defect estimation models.
Keywords :
learning (artificial intelligence); program testing; software metrics; attribute-value vectors extracting; bags defect-proneness; cost reduction; defect-prone software modules; high level modules; high level software modules; learning task; multi-instance learning; software defect estimation model; software development; software metrics; software testing; supervised learning; supervised schema; Availability; Costs; Mission critical systems; NASA; Programming; Resource management; Software metrics; Software performance; Software testing; Supervised learning; kernel methods; multi-instance learning; software defect estimation; support vector machine;
Conference_Titel :
Research Challenges in Computer Science, 2009. ICRCCS '09. International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-0-7695-3927-0
Electronic_ISBN :
978-1-4244-5410-5
DOI :
10.1109/ICRCCS.2009.19