DocumentCode :
3320657
Title :
The introduction of MEMS packaging technology
Author :
Hsieh, C.T. ; Ting, Jyh-Ming ; Yang, Charles ; Chung, C.K.
Author_Institution :
Dept. of Mater. Sci. & Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
fYear :
2002
fDate :
4-6 Dec. 2002
Firstpage :
300
Lastpage :
306
Abstract :
In modem consumer electronic devices, not only the weightless and small-sized but also the multi-function specifications are required. The devices made by MEMS technology have become the major tendency of the products because they consist the above characters. Involving the electronics, optoelectronics, information, mechanics, materials, biochemistry and control technologies, the MEMS techniques is the most potential science and will have great influence on human life in the twenty first century. The packaging technique is the key point in the MEMS devices, so it is necessary to study the techniques and the materials for the MEMS packing. In this study, the MEMS packaging techniques, including the packaging types and functions would be introduced.
Keywords :
micromechanical devices; packaging; MEMS packaging technology; consumer electronic device; Biological materials; Electronics packaging; Heat transfer; Integrated circuit packaging; Materials science and technology; Microelectromechanical devices; Micromechanical devices; Semiconductor device packaging; Silicon; Wafer scale integration;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on
Print_ISBN :
0-7803-7682-X
Type :
conf
DOI :
10.1109/EMAP.2002.1188855
Filename :
1188855
Link To Document :
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