DocumentCode
3320657
Title
The introduction of MEMS packaging technology
Author
Hsieh, C.T. ; Ting, Jyh-Ming ; Yang, Charles ; Chung, C.K.
Author_Institution
Dept. of Mater. Sci. & Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
fYear
2002
fDate
4-6 Dec. 2002
Firstpage
300
Lastpage
306
Abstract
In modem consumer electronic devices, not only the weightless and small-sized but also the multi-function specifications are required. The devices made by MEMS technology have become the major tendency of the products because they consist the above characters. Involving the electronics, optoelectronics, information, mechanics, materials, biochemistry and control technologies, the MEMS techniques is the most potential science and will have great influence on human life in the twenty first century. The packaging technique is the key point in the MEMS devices, so it is necessary to study the techniques and the materials for the MEMS packing. In this study, the MEMS packaging techniques, including the packaging types and functions would be introduced.
Keywords
micromechanical devices; packaging; MEMS packaging technology; consumer electronic device; Biological materials; Electronics packaging; Heat transfer; Integrated circuit packaging; Materials science and technology; Microelectromechanical devices; Micromechanical devices; Semiconductor device packaging; Silicon; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on
Print_ISBN
0-7803-7682-X
Type
conf
DOI
10.1109/EMAP.2002.1188855
Filename
1188855
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