• DocumentCode
    3320657
  • Title

    The introduction of MEMS packaging technology

  • Author

    Hsieh, C.T. ; Ting, Jyh-Ming ; Yang, Charles ; Chung, C.K.

  • Author_Institution
    Dept. of Mater. Sci. & Eng., Nat. Cheng Kung Univ., Tainan, Taiwan
  • fYear
    2002
  • fDate
    4-6 Dec. 2002
  • Firstpage
    300
  • Lastpage
    306
  • Abstract
    In modem consumer electronic devices, not only the weightless and small-sized but also the multi-function specifications are required. The devices made by MEMS technology have become the major tendency of the products because they consist the above characters. Involving the electronics, optoelectronics, information, mechanics, materials, biochemistry and control technologies, the MEMS techniques is the most potential science and will have great influence on human life in the twenty first century. The packaging technique is the key point in the MEMS devices, so it is necessary to study the techniques and the materials for the MEMS packing. In this study, the MEMS packaging techniques, including the packaging types and functions would be introduced.
  • Keywords
    micromechanical devices; packaging; MEMS packaging technology; consumer electronic device; Biological materials; Electronics packaging; Heat transfer; Integrated circuit packaging; Materials science and technology; Microelectromechanical devices; Micromechanical devices; Semiconductor device packaging; Silicon; Wafer scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on
  • Print_ISBN
    0-7803-7682-X
  • Type

    conf

  • DOI
    10.1109/EMAP.2002.1188855
  • Filename
    1188855