Title :
Electrical properties of ultrasmall low temperature solder joints for LCD driver IC packaging applications
Author :
Kang, Un-Byoung ; Kim, Young-Ho
Author_Institution :
Div. of Mater. Sci. & Eng., Hanyang Univ., Seoul, South Korea
Abstract :
We studied the electrical characteristics of ultrasmall eutectic Bi-Sn and eutectic In-Ag solder joints for LCD driver IC packaging applications. Using the eutectic Bi-Sn and eutectic In-Ag solder bumps of 80-50 μm pitch sizes, a ultrafine solder joint between an IC and the glass substrate was successfully made at 160°C. The contact resistances of the solder joint were 42 mΩ at 50 □ pitch and 8-12 mΩ at 80 □ pitch, which was much lower than that of the joint made using the conventional ACF bonding technique. The Bi-Sn solder joints with underfill showed excellent reliability in a hot humid environment.
Keywords :
contact resistance; driver circuits; electric properties; eutectic alloys; fine-pitch technology; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; liquid crystal displays; microassembling; soldering; 160 degC; 42 mohm; 50 to 80 micron; 8 to 12 mohm; Bi-Sn; COG technique; IC bonding; In-Ag; LCD driver IC packaging applications; chip on glass packaging; electrical characteristics; eutectic Bi-Sn solder joints; eutectic In-Ag solder joints; flip chip bonding process; glass substrate; hot humid environment; low temperature solder joints; reliability; spherical-shaped solder joints; ultrasmall eutectic solder joints; underfill; Bonding; Coatings; Conductive adhesives; Contact resistance; Flip chip; Glass; Integrated circuit packaging; Soldering; Temperature; Testing;
Conference_Titel :
Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on
Print_ISBN :
0-7803-7682-X
DOI :
10.1109/EMAP.2002.1188864
