DocumentCode :
3320917
Title :
LTCC for wireless and photonic packaging applications
Author :
Chai, Liang ; Shaikh, Aziz ; Stygar, Vern
fYear :
2002
fDate :
4-6 Dec. 2002
Firstpage :
381
Lastpage :
385
Abstract :
Wireless and photonic applications have imposed challenging requirements on packaging materials, such as flat frequency response, low dielectric loss from DC to 100 GHz, and high density interconnects. Ferro´s A6 LTCC is well known in the industry for having a low dielectric constant and loss tangent and having a flat dielectric loss response from DC to 100 GHz. Ferro´s A6 LTCC family of products is uniquely positioned to meet the needs of wireless and photonic packaging applications. Ferro has for many years focused on the low dielectric loss property of A6 to provide the RF engineers with outstanding insertion loss characteristics. Both insertion loss and effective dielectric constant can be determined using the ring resonator method. Moreover, the loss contributions, such, dielectric loss, conductor loss and surface roughness loss, can be simulated. The knowledge of loss contributions can assist the RF engineer in maximizing the performance of the LTCC circuit and presenting the lowest cost solution to the market. In this presentation, the measurement techniques for low loss A6 over a wide range of frequencies will be reviewed. Simulation results on various loss mechanism and fine lines will also be discussed.
Keywords :
ceramic packaging; dielectric losses; microstrip resonators; permittivity; 0 to 100 GHz; LTCC circuit; RF engineering; conductor loss; dielectric constant; dielectric loss tangent; frequency response; high density interconnect; insertion loss; microstrip ring resonator; photonic packaging; surface roughness loss; wireless packaging; Circuit simulation; Dielectric constant; Dielectric losses; Dielectric materials; Frequency response; Insertion loss; Integrated circuit interconnections; Optical losses; Packaging; Radio frequency;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on
Print_ISBN :
0-7803-7682-X
Type :
conf
DOI :
10.1109/EMAP.2002.1188869
Filename :
1188869
Link To Document :
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