• DocumentCode
    3320940
  • Title

    Tightly coupling LTCC microwave coupled lines: analysis, modeling and realization

  • Author

    Deng, Joseph D S ; Hsiao, Feng-Ka ; Kuo, Jen-I ; Horng, Kuo Young ; Lee, Ching-Yuan ; Wu, Chung-Sen

  • Author_Institution
    Electron. Syst. Res. Div., CSIST, Taoyuan, Taiwan
  • fYear
    2002
  • fDate
    4-6 Dec. 2002
  • Firstpage
    391
  • Lastpage
    396
  • Abstract
    This paper presents the analysis and modeling techniques of broad side coupling structures fabricated with LTCC technique. By applying multi-conductor C-matrix and L-matrix extraction techniques to model small segment of two conductors vertically stacked on different layers of LTCC substrate, informations for designing a coupler were obtained. Knowing the C-matrix and L-matrix and their corresponding physical structure, we could synthesize the couplers of designated electrical properties. Applying the modeling and analysis techniques, the microwave tight coupling asymmetrical coupled lines were designed and realized with LTCC technique. The coupler could be tightly coupling with coefficient better than 3dB, isolation better than 35dB and about 40 dB directivity.
  • Keywords
    coupled transmission lines; microstrip couplers; multiconductor transmission lines; transmission line matrix methods; C-matrix; L-matrix; LTCC microwave coupled lines; electrical properties; microstrip coupler; multiconductor transmission line; Circuit simulation; Circuit synthesis; Computational modeling; Coupled mode analysis; Coupling circuits; Electromagnetic scattering; Equivalent circuits; Signal sampling; Strips; Thick films;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on
  • Print_ISBN
    0-7803-7682-X
  • Type

    conf

  • DOI
    10.1109/EMAP.2002.1188871
  • Filename
    1188871