DocumentCode :
3320940
Title :
Tightly coupling LTCC microwave coupled lines: analysis, modeling and realization
Author :
Deng, Joseph D S ; Hsiao, Feng-Ka ; Kuo, Jen-I ; Horng, Kuo Young ; Lee, Ching-Yuan ; Wu, Chung-Sen
Author_Institution :
Electron. Syst. Res. Div., CSIST, Taoyuan, Taiwan
fYear :
2002
fDate :
4-6 Dec. 2002
Firstpage :
391
Lastpage :
396
Abstract :
This paper presents the analysis and modeling techniques of broad side coupling structures fabricated with LTCC technique. By applying multi-conductor C-matrix and L-matrix extraction techniques to model small segment of two conductors vertically stacked on different layers of LTCC substrate, informations for designing a coupler were obtained. Knowing the C-matrix and L-matrix and their corresponding physical structure, we could synthesize the couplers of designated electrical properties. Applying the modeling and analysis techniques, the microwave tight coupling asymmetrical coupled lines were designed and realized with LTCC technique. The coupler could be tightly coupling with coefficient better than 3dB, isolation better than 35dB and about 40 dB directivity.
Keywords :
coupled transmission lines; microstrip couplers; multiconductor transmission lines; transmission line matrix methods; C-matrix; L-matrix; LTCC microwave coupled lines; electrical properties; microstrip coupler; multiconductor transmission line; Circuit simulation; Circuit synthesis; Computational modeling; Coupled mode analysis; Coupling circuits; Electromagnetic scattering; Equivalent circuits; Signal sampling; Strips; Thick films;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Materials and Packaging, 2002. Proceedings of the 4th International Symposium on
Print_ISBN :
0-7803-7682-X
Type :
conf
DOI :
10.1109/EMAP.2002.1188871
Filename :
1188871
Link To Document :
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