High performance packaging with multilayer ceramic antenna switch module for wireless communication

With increasing performance and functional integration of semiconductor technology the packaging of the chips gains more important for the design of complex microelectronic system. Ceramic chip carriers are an important element of packages, which have to fit to the continuously improving semiconductor performance. Ceramic packages offer several advantages compared to conventional plastic packages. The superior thermal and mechanical properties ensure an excellent reliability. Low temperature ceramic cofiring (LTCC) is useful in the manufacture of a broad range of radio frequency components. When several basic components, such as capacitor, inductor and transmission lines are integrated into a single multilayer ceramic package, a small and more consistent circuit can be achieved. An antenna switch was constructed using LTCC. Aspects of the device construction and electrical performances are presented.