DocumentCode :
3321117
Title :
Effects of thermo-mechanical stress in solder joints under high current stressing
Author :
Zhang, Jinsong ; Wu, Yiping ; Xi, Hongjia ; An, Bing ; Wu, Fengshun
fYear :
2007
fDate :
14-17 Aug. 2007
Firstpage :
1
Lastpage :
5
Keywords :
Current density; Electromigration; Heating; Joining materials; Materials science and technology; Petroleum; Soldering; Temperature; Thermal stresses; Thermomechanical processes;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology, 2007. ICEPT 2007. 8th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-1392-8
Electronic_ISBN :
978-1-4244-1392-8
Type :
conf
DOI :
10.1109/ICEPT.2007.4497324
Filename :
4497324
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3321117
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