A system architecture for use with free space optical interconnects in a 3D stacked processor environment

Author

Roril, J. ; Marchand, P. ; Chandramani, P. ; Ekman, J. ; Kiamilev, F. ; Zane, F. ; Ozguz, V. ; Esener, S.C.

Author_Institution

Dept. of Electr. Eng., North Carolina Univ., Charlotte, NC, USA

fYear

1998

fDate

20-24 July 1998

Abstract

There exists a technology suited for dealing with the unique constraints of the 3D stacked processor environment; free space optical interconnects (FSOI). This technology uses VCSEL´s, vertical cavity surface emitting lasers, as a communications medium. FSOI has been proven to work in a two dimensional matrix format that would be optimal for communications between stacks.

Keywords

VLSI; optical computing; optical interconnections; parallel architectures; semiconductor lasers; surface emitting lasers; 2D matrix format; 3D stacked processor environment; VCSEL; free space optical interconnects; system architecture; vertical cavity surface emitting lasers; Application software; High speed optical techniques; Isolation technology; Logic; Optical interconnections; Optical signal processing; Routing; Space technology; Vertical cavity surface emitting lasers; Very large scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Broadband Optical Networks and Technologies: An Emerging Reality/Optical MEMS/Smart Pixels/Organic Optics and Optoelectronics. 1998 IEEE/LEOS Summer Topical Meetings

Conference_Location

Monterey, CA, USA

Print_ISBN

0-7803-4953-9

Type

conf

DOI

10.1109/LEOSST.1998.690426

Filename

690426