Polishing of bulk micro-machined substrates by fixed abrasive pads for smoothing and planarization of MEMS structures

Author

Kulawski, Martin ; Luoto, Hannu ; Henttinen, Kimmo ; Suni, Tommi ; Weimar, Frauke ; Makinen, Jari

Author_Institution

VTT Microelectronics, Espoo

fYear

2005

fDate

11-12 April 2005

Firstpage

5

Lastpage

10

Abstract

In this work, an approach was made to use chemical mechanical polishing (CMP) by prototype fixed abrasive (FA) pads rather then conventional slurry based polishing for smoothing of bulk micro-machined and oxidized silicon wafers. A comparison is provided to conventional CMP, showing the minimization of edge rounding in case of FA use under the needed polishing step for sub-sequent wafer bonding. Simultaneously the achieved roughness provides a surface quality suitable for direct wafer bonding

Keywords

abrasives; chemical mechanical polishing; micromachining; micromechanical devices; planarisation; prototypes; silicon compounds; substrates; surface roughness; wafer bonding; CMP; MEMS structures; SiO₂; bulk micromachined substrates; chemical mechanical polishing; direct wafer bonding; fixed abrasive pads; microelectromechanical system; oxidized silicon wafers; planarization process; prototype; smoothing process; surface quality; Abrasives; Chemicals; Micromechanical devices; Planarization; Prototypes; Rough surfaces; Silicon; Slurries; Smoothing methods; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Semiconductor Manufacturing Conference and Workshop, 2005 IEEE/SEMI

Conference_Location

Munich

Print_ISBN

0-7803-8997-2

Type

conf

DOI

10.1109/ASMC.2005.1438758

Filename

1438758