DocumentCode
3321658
Title
2004 - the year of 90-nm: a review of 90 nm devices
Author
James, Dick
Author_Institution
Chipworks Inc., Ottawa, Ont.
fYear
2005
fDate
11-12 April 2005
Firstpage
72
Lastpage
76
Abstract
The year 2004 saw the introduction of the first 90-nm process node devices into the marketplace. This node is notable not only for the expected reduction in feature sizes, but also for the more general adoption of low-k dielectric layers, and the first use of nickel silicide and strained silicon. Chipworks, as a supplier of competitive intelligence to the semiconductor and electronics industries, monitors the evolution of chip processes as they come into commercial production. Chipworks has obtained parts from leading edge manufacturers, and performed structural analyses to examine the features and manufacturing processes of the devices. The paper shows how "90 nm" has been interpreted by various vendors, details the physical transistor structures we have analyzed, and comments on the introduction of strain into CMOS processing
Keywords
CMOS integrated circuits; electronics industry; nanotechnology; nickel compounds; semiconductor device manufacture; silicon; transistors; 90 nm; 90-nm process node devices; CMOS processing; Chipworks; NiSi; chip processes; electronics industries; feature sizes; low-k dielectric layers; nickel silicide; physical transistor structures; semiconductor industries; strained silicon; Competitive intelligence; Dielectrics; Electronics industry; Manufacturing processes; Nickel; Performance analysis; Production; Semiconductor device manufacture; Silicides; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference and Workshop, 2005 IEEE/SEMI
Conference_Location
Munich
Print_ISBN
0-7803-8997-2
Type
conf
DOI
10.1109/ASMC.2005.1438770
Filename
1438770
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