• DocumentCode
    3321658
  • Title

    2004 - the year of 90-nm: a review of 90 nm devices

  • Author

    James, Dick

  • Author_Institution
    Chipworks Inc., Ottawa, Ont.
  • fYear
    2005
  • fDate
    11-12 April 2005
  • Firstpage
    72
  • Lastpage
    76
  • Abstract
    The year 2004 saw the introduction of the first 90-nm process node devices into the marketplace. This node is notable not only for the expected reduction in feature sizes, but also for the more general adoption of low-k dielectric layers, and the first use of nickel silicide and strained silicon. Chipworks, as a supplier of competitive intelligence to the semiconductor and electronics industries, monitors the evolution of chip processes as they come into commercial production. Chipworks has obtained parts from leading edge manufacturers, and performed structural analyses to examine the features and manufacturing processes of the devices. The paper shows how "90 nm" has been interpreted by various vendors, details the physical transistor structures we have analyzed, and comments on the introduction of strain into CMOS processing
  • Keywords
    CMOS integrated circuits; electronics industry; nanotechnology; nickel compounds; semiconductor device manufacture; silicon; transistors; 90 nm; 90-nm process node devices; CMOS processing; Chipworks; NiSi; chip processes; electronics industries; feature sizes; low-k dielectric layers; nickel silicide; physical transistor structures; semiconductor industries; strained silicon; Competitive intelligence; Dielectrics; Electronics industry; Manufacturing processes; Nickel; Performance analysis; Production; Semiconductor device manufacture; Silicides; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference and Workshop, 2005 IEEE/SEMI
  • Conference_Location
    Munich
  • Print_ISBN
    0-7803-8997-2
  • Type

    conf

  • DOI
    10.1109/ASMC.2005.1438770
  • Filename
    1438770