Title :
Comparison of three different methods to model the semiconductor manufacturing yield
Author :
Dupret, Yoan ; Perrin, Erwan ; Grolier, JeanLuc ; Kielbasa, Richard
Author_Institution :
AItis Semicond., Corbeil-Essonnes
Abstract :
During a semiconductor manufacturing process a large amount of data is stored in databases. These data can be used to model the semiconductor manufacturing yield. A model of the yield according to process measurements is useful to predict the yield before final tests. It is also an help to do sensitivity analysis of the yield to process variations. This paper compares three methods to model the manufacturing yield from test data. Principal components analysis, independent component analysis and partial least squares regression are reviewed. A methodology is then exposed to achieve, efficient manufacturing yield modeling
Keywords :
independent component analysis; integrated circuit yield; least squares approximations; principal component analysis; production engineering computing; regression analysis; semiconductor process modelling; sensitivity analysis; independent component analysis; manufacturing yield modeling; partial least squares regression; principal components analysis; process measurements; semiconductor manufacturing process; Databases; Independent component analysis; Manufacturing processes; Predictive models; Principal component analysis; Pulp manufacturing; Semiconductor device manufacture; Sensitivity analysis; Testing; Virtual manufacturing;
Conference_Titel :
Advanced Semiconductor Manufacturing Conference and Workshop, 2005 IEEE/SEMI
Conference_Location :
Munich
Print_ISBN :
0-7803-8997-2
DOI :
10.1109/ASMC.2005.1438778
