DocumentCode
3322369
Title
Exploring new design architectures to reach time-to-market goals
Author
Fujimura, Aki ; Joshi, Ketan
Author_Institution
X Initiative, Mountain View, CA
fYear
2005
fDate
11-12 April 2005
Firstpage
239
Lastpage
242
Abstract
This paper discusses how an open collaboration model and an innovative interconnect design are working in tandem to address key technical and manufacturing challenges, enabling chipmakers to achieve increasingly aggressive time-to-market goals
Keywords
integrated circuit manufacture; time to market; chipmakers; design architectures; innovative interconnect design; manufacturing challenges; open collaboration model; time-to-market goals; Collaboration; Computer architecture; Delay effects; Integrated circuit interconnections; Integrated circuit yield; Semiconductor device manufacture; Supply chains; Time to market; Wires; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference and Workshop, 2005 IEEE/SEMI
Conference_Location
Munich
Print_ISBN
0-7803-8997-2
Type
conf
DOI
10.1109/ASMC.2005.1438802
Filename
1438802
Link To Document