Modeling of heat dissipation in SMD chip components

The ever-rising pressure to reduce circuit board size to fit the ever-shrinking chassis challenges design engineers not just with size constraints, but power and thermal constraints concurrently. The power dissipation of a circuit is not necessarily reduced as technologies advance and circuits become smaller. It may not be an acceptable option to reduce the power dissipation and there may even be a drive to increase it. Reliability is a major concern of all electronic products manufacturers, and it is given by the reliabilities of the electronic components. One factor that determines the operation time of electronic components is temperature, and to be more precisely heat dissipation. There appears the problem of how heat is dissipated from SMD components, especially when no forced cooling is available.