Title :
Packaging and thermal analysis of a power inverter for inductive heating applications
Author :
Man, Lucian ; Pop, Ovidiu ; Tâut, Adrian
Author_Institution :
Appl. Electron. Dept., Tech. Univ. of Cluj-Napoca, Cluj-Napoca, Romania
Abstract :
The Intermediate Data Format (IDF) is a specification designed to provide a neutral representation for exchanging printed circuit assembly (PCA) data among mechanical design (MCAD), PCA layout (ECAD), and physical design analysis (MCAE) applications. The paper presents a combined analysis for a power inverter for induction heating applications. The inverter is also studied via a comprehensive analysis with operation equations of the circuit. An alternative to the use of circuit-oriented simulators for study of these circuits operating is to describe the circuit and the controller by means of differential and algebraic equations.
Keywords :
invertors; printed circuit layout; thermal analysis; PCA layout; inductive heating; intermediate data format; mechanical design; neutral representation; packaging analysis; power inverter; printed circuit assembly data; thermal analysis; Design automation; Electronic packaging thermal management; Heat transfer; Integrated circuit modeling; Inverters; Solid modeling; Thermal analysis; CAD; IDF; MCAD; Matlab; thermal analysis;
Conference_Titel :
Design and Technology in Electronic Packaging (SIITME), 2010 IEEE 16th International Symposium for
Conference_Location :
Pitesti
Print_ISBN :
978-1-4244-8123-1
DOI :
10.1109/SIITME.2010.5650842
