Title :
3-D floorplanning algorithm to minimize thermal interactions
Author :
Vaisband, Boris ; Friedman, Eby G.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Rochester, Rochester, NY, USA
Abstract :
An algorithm for including relative thermal interactions among different circuit modules within a 3-D system is introduced in this paper. Application of the proposed algorithm on MCNC and GSRC benchmark circuits is presented. The thermal behavior of a heterogeneous 3-D structure, consisting of a different number of modules and substrate materials, is evaluated to emulate the heat transfer characteristics of practical heterogeneous 3-D systems. The algorithm lowers thermal interactions between different modules while maintaining the peak temperature within a practical range. The thermal characteristics of the floorplan are evaluated using HotSpot and HotSpot Detailed 3-D and compared to a random floorplan. The recorded peak temperatures are within the practical range of on-chip temperatures.
Keywords :
Monte Carlo methods; heat transfer; integrated circuit layout; 3D floorplanning algorithm; GSRC benchmark circuits; HotSpot detailed 3D; MCNC benchmark circuits; circuit modules; heat transfer characteristics; heterogeneous 3D structure; on-chip temperatures; relative thermal interactions; Benchmark testing; Heating; Temperature distribution; Temperature sensors; Thermal conductivity; Thermal resistance;
Conference_Titel :
Circuits and Systems (ISCAS), 2015 IEEE International Symposium on
Conference_Location :
Lisbon
DOI :
10.1109/ISCAS.2015.7169101
