3-D floorplanning algorithm to minimize thermal interactions

Author

Vaisband, Boris ; Friedman, Eby G.

Author_Institution

Dept. of Electr. & Comput. Eng., Univ. of Rochester, Rochester, NY, USA

fYear

2015

fDate

24-27 May 2015

Firstpage

2133

Lastpage

2136

Abstract

An algorithm for including relative thermal interactions among different circuit modules within a 3-D system is introduced in this paper. Application of the proposed algorithm on MCNC and GSRC benchmark circuits is presented. The thermal behavior of a heterogeneous 3-D structure, consisting of a different number of modules and substrate materials, is evaluated to emulate the heat transfer characteristics of practical heterogeneous 3-D systems. The algorithm lowers thermal interactions between different modules while maintaining the peak temperature within a practical range. The thermal characteristics of the floorplan are evaluated using HotSpot and HotSpot Detailed 3-D and compared to a random floorplan. The recorded peak temperatures are within the practical range of on-chip temperatures.

Keywords

Monte Carlo methods; heat transfer; integrated circuit layout; 3D floorplanning algorithm; GSRC benchmark circuits; HotSpot detailed 3D; MCNC benchmark circuits; circuit modules; heat transfer characteristics; heterogeneous 3D structure; on-chip temperatures; relative thermal interactions; Benchmark testing; Heating; Temperature distribution; Temperature sensors; Thermal conductivity; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Circuits and Systems (ISCAS), 2015 IEEE International Symposium on

Conference_Location

Lisbon

Type

conf

DOI

10.1109/ISCAS.2015.7169101

Filename

7169101