Design and analysis of reliable maintenance networks for wafer scale integration

The authors describe the application of fault-tolerant and distributed networking concepts and techniques to VLSI system maintenance networks targeted to wafer-scale integration (WSI) designs. In particular, the effects on overall system reliability due to wafer-level maintenance network interconnection electromigration failures are evaluated. Distributed bus and ring networks are examined, and are evaluated using a series model in order to determine overall system reliability. A comparison is made between the distributed bus, distributed ring, and an ideal redundant ring maintenance network topology. It is shown that the effects of electromigration will significantly influence the topological design decision, and that the ring architecture has advantages for WSI under long mission time scenarios