Development of three dimensional ceramic-based MCM inductors for hybrid RF/microwave applications

Author

Sutono, A. ; Pham, A. ; Laskar, J. ; Smith, W.R.

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

fYear

1999

fDate

1999

Firstpage

175

Lastpage

178

Abstract

We present the design, development and characterization of planar and multilayer (3-D) inductor structures fabricated on a multi-layer ceramic-based Multi-Chip-Module (MCM-C) technology. We experimentally demonstrate the feasibility of utilizing both planar and compact 3-D helical inductors for hybrid RF and microwave system implementation. For the same numbers of turns and dimensions as the conventional planar inductor, the 3-D helical inductors occupies significantly less area and demonstrate better quality (Q) factor, higher inductance and comparable self resonant frequency (SRF)

Keywords

Q-factor; UHF integrated circuits; hybrid integrated circuits; inductors; microwave integrated circuits; multichip modules; 3D ceramic-based MCM inductors; LTCC technology; MCM-C technology; characterization; compact 3D helical inductors; hybrid RF applications; hybrid microwave application; multilayer inductor structures; planar inductor structures; quality factor; self resonant frequency; Application software; Ceramics; Inductance; Inductors; Low-noise amplifiers; MMICs; Q factor; Radio frequency; Resistors; Spirals;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio Frequency Integrated Circuits (RFIC) Symposium, 1999 IEEE

Conference_Location

Anaheim, CA

ISSN

1097-2633

Print_ISBN

0-7803-5604-7

Type

conf

DOI

10.1109/RFIC.1999.805265

Filename

805265