Title :
FODEL(R) photoimageable technology in microwave applications
Author :
Dziurdzia, Barbara ; Nowak, Stanislaw
Author_Institution :
Res. & Dev. Centre for Hybrid Microelectron. & Resistors, Krakow, Poland
Abstract :
New circuit technologies capable of delivering high volume production, low cost microwave hybrids are still being sought. Advanced thick film technology offers new solutions suitable for microwave performance: the etching of fired thick films and the photoimaging of photosensitive thick films. Both techniques, using novel thick film materials and photopatterning gives a performance comparable with thin film techniques at significantly lower cost
Keywords :
UHF integrated circuits; etching; hybrid integrated circuits; integrated circuit manufacture; integrated circuit technology; microwave integrated circuits; photolithography; thick film circuits; FODEL photoimageable technology; advanced thick film technology; etching; fired thick films; high volume production; hybrid MICs; low cost microwave hybrids; microwave applications; photoimaging; photopatterning; photosensitive thick films; Conducting materials; Costs; Dielectric substrates; Etching; Gold; Microwave technology; Space technology; Thick film circuits; Thick films; Thin film circuits;
Conference_Titel :
Microwaves and Radar, 1998. MIKON '98., 12th International Conference on
Conference_Location :
Krakow
Print_ISBN :
83-906662-0-0
DOI :
10.1109/MIKON.1998.740821
