• DocumentCode
    3324735
  • Title

    A 6.42 mW low-power feed-forward FxLMS ANC VLSI design for in-ear headphones

  • Author

    Hong-Son Vu ; Kuan-Hung Chen ; Shih-Feng Sun ; Tien-Mau Fong ; Che-Wei Hsu ; Lei Wang

  • Author_Institution
    Electr. & Commun. Eng., Feng Chia Univ., Taichung, Taiwan
  • fYear
    2015
  • fDate
    24-27 May 2015
  • Firstpage
    2585
  • Lastpage
    2588
  • Abstract
    Conventional active noise cancellation (ANC) applications often use high-speed digital signal processors (DSPs) to cancel annoying noise, which result in an expensive cost and high-power dissipation for modern portable devices. To achieve both high-performance and low-power consumption requirements, this paper proposes a dedicated feed-forward filtered-x least mean square (FxLMS) ANC VLSI design for in-ear headphones. The validity of the proposed design is then verified through adopting experiments in an anechoic chamber. Experimental results show that the proposed design can attenuate 15 dB for broadband pink noise with a bandwidth of 50-1500 Hz when operated at 10 MHz clock frequency, at the costs of 84.2 k gates and power consumption of 6.42 mW only.
  • Keywords
    VLSI; active noise control; digital signal processing chips; feedforward; headphones; integrated circuit design; integrated circuit noise; least mean squares methods; low-power electronics; DSP; active noise cancellation; anechoic chamber; bandwidth 50 Hz to 1500 Hz; broadband pink noise; clock frequency; digital signal processor; feed-forward filtered-x least mean square; frequency 10 MHz; high-power dissipation; in-ear headphone; low-power feed-forward FxLMS ANC VLSI design; portable device; power 6.42 mW; power consumption; Bandwidth; Broadband communication; Digital signal processing; Finite impulse response filters; Headphones; Noise; Noise reduction; VLSI design; active noise cancellation; feedforward FxLMS; in-ear headphone;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (ISCAS), 2015 IEEE International Symposium on
  • Conference_Location
    Lisbon
  • Type

    conf

  • DOI
    10.1109/ISCAS.2015.7169214
  • Filename
    7169214