• DocumentCode
    3324981
  • Title

    A 5-tissue-layer lumped-element based HBC circuit model compatible to IEEE802.15.6

  • Author

    Jingna Mao ; Bo Zhao ; Yong Lian ; Huazhong Yang

  • Author_Institution
    Dept. of Electron. Eng., Tsinghua Univ., Beijing, China
  • fYear
    2015
  • fDate
    24-27 May 2015
  • Firstpage
    2632
  • Lastpage
    2635
  • Abstract
    Human body communication (HBC) has significant advantage over wireless communication schemes in wireless body area networks (WBANs) in terms of power efficiency due to the high conductivity of human body. An accurate circuit model for transmission channel is necessary for optimizing the HBC transceiver performance. Conventional models achieve limited accuracy because of incomplete body tissue model or the use of tranmission-line at circuit level. In this paper, we proposed a comprehensive HBC circuit model which is based on 5 human-surface tissue layers representing the physiological characteristics of living tissues and the frequency dependence of their dielectric properties. Instead of using transmission-line, our model is based on lumped-element analysis, which is more accurate at the 21 MHz frequency band specified by the IEEE 802.15.6 HBC standard. We verified the proposed model by actual measurement on human body at various of communication distances. Experimental results show that the proposed model achieved the minimum error among all the modeling works, i.e., 1.80% minimum error and 2.24% maximal error at various communication distances.
  • Keywords
    body area networks; wireless channels; HBC circuit model; HBC transceiver; IEEE802.15.6; WBAN; accurate circuit model; circuit level; communication distances; dielectric properties; frequency dependence; human body communication; human surface tissue layers; lumped element analysis; tissue layer lumped element; tranmission line; transmission channel; wireless body area networks; wireless communication schemes;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (ISCAS), 2015 IEEE International Symposium on
  • Conference_Location
    Lisbon
  • Type

    conf

  • DOI
    10.1109/ISCAS.2015.7169226
  • Filename
    7169226