DocumentCode
3325095
Title
The non-uniqueness of breakdown distributions in silicon oxides
Author
Jackson, J.C. ; Oralkan, Ö ; Robinson, T. ; Dumin, D.J. ; Brown, G.A.
Author_Institution
Center for Semicond. Device Reliability Res., Clemson Univ., Clemson, SC, USA
fYear
1997
fDate
13-16 Oct 1997
Firstpage
50
Lastpage
55
Abstract
Time-dependent-dielectric-breakdown (TDDB) distributions obtained from oxides of the same physical geometry and stressed at the same electric field were found to shift to shorter times when the amount of energy available to flow through electric breakdowns was increased. This paper shows that TDDB distributions are nonunique and that for a breakdown model to accurately describe the reliability of an oxide during actual use conditions, the oxide thermal geometry must be taken into account. An accurate method of obtaining electric breakdown distributions is also presented which allows the use of smaller sample sizes to obtain time-dependent-electric-breakdown (TDEB) distributions which are similar to TDDB distributions
Keywords
dielectric thin films; electric breakdown; electric fields; integrated circuit modelling; integrated circuit reliability; integrated circuit testing; silicon compounds; thermal analysis; Si; SiO2-Si; TDDB distributions; TDEB distributions; breakdown distributions; breakdown model; electric breakdown distribution; electric breakdown energy flow; oxide electric field stress; oxide physical geometry; oxide reliability; oxide thermal geometry; sample size; silicon oxides; time-dependent-dielectric-breakdown (TDDB) distributions; time-dependent-electric-breakdown distributions; Anodes; Capacitors; Cathodes; Circuits; Dielectric breakdown; Dielectric measurements; Electric breakdown; Electric resistance; Geometry; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop Final Report, 1997 IEEE International
Conference_Location
Lake Tahoe, CA
Print_ISBN
0-7803-4205-4
Type
conf
DOI
10.1109/IRWS.1997.661871
Filename
661871
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