DocumentCode :
3325535
Title :
An empirical investigation of the relationship between intellectual capital and firms’ development ability
Author :
Jin Shui-ying
Author_Institution :
Sch. of Prof. Technol., Zhejiang Normal Univ.
fYear :
2008
fDate :
10-12 Sept. 2008
Firstpage :
1060
Lastpage :
1066
Abstract :
The principal purpose of this article is to investigate empirically the relation between intellectual capital and firmspsila development ability. Using data drawn from a sample of 432 publicly traded firms in China and Pulicpsilas Value Added Intellectual Coefficient (VAIC) as the efficiency measure of intellectual capital, the author constructs two panel data models to examine the relationship between intellectual capital and firmspsila development ability. Findings indicate that intellectual capital contributes to firmspsila development ability positively. In addition, the empirical results show that human capital and structural capital which are the components of intellectual capital both contribute to firmspsila development ability. Finally, the author finds the relation between physical capital and firmspsila development ability is not distinct. The results extend the understanding of the role of intellectual capital in promoting firmspsila development ability and creating sustainable advantages for firms in developing countries.
Keywords :
industrial property; organisational aspects; data models; firm development ability; human capital; intellectual capital; structural capital; value added intellectual coefficient; Aggregates; Conference management; Cost accounting; Data models; Engineering management; Humans; Knowledge management; Performance analysis; Sustainable development; Technology management; VAIC; firms’ development ability; intellectual capital; physical capital;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Management Science and Engineering, 2008. ICMSE 2008. 15th Annual Conference Proceedings., International Conference on
Conference_Location :
Long Beach, CA
Print_ISBN :
978-1-4244-2387-3
Electronic_ISBN :
978-1-4244-2388-0
Type :
conf
DOI :
10.1109/ICMSE.2008.4669042
Filename :
4669042
Link To Document :
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