DocumentCode :
3325575
Title :
Study of interconnect vias by the discrete surface integral method
Author :
Shi, Hao ; Drewniak, James L.
Author_Institution :
Dept. of Electr. Eng., Missouri Univ., Rolla, MO, USA
fYear :
195
fDate :
14-18 Aug 195
Firstpage :
228
Lastpage :
233
Abstract :
A non-orthogonal time-domain full-wave solver, is developed based on the discrete surface integral (DSI) technique. Closed form expressions are derived for the coefficients used in the leap-frog computation scheme so that the DSI technique can be implemented as a generalised finite-difference procedure. This procedure is employed to investigate the propagation characteristics of a typical interconnect via in printed circuits. The numerically calculated scattering parameters show consistent behavior with measured results. A square via with equal area is also evaluated
Keywords :
S-parameters; finite difference time-domain analysis; integral equations; printed circuits; closed form expressions; coefficients; discrete surface integral; discrete surface integral method; finite-difference procedure; interconnect vias; measured results; nonorthogonal time-domain full-wave solver; printed circuits; propagation characteristics; scattering parameters; square via; Electromagnetic waveguides; Finite difference methods; Geometry; Integral equations; Integrated circuit interconnections; Maxwell equations; Printed circuits; Sampling methods; Time domain analysis; Transient analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, 1995. Symposium Record., 1995 IEEE International Symposium on
Conference_Location :
Atlanta, GA
Print_ISBN :
0-7803-3608-9
Type :
conf
DOI :
10.1109/ISEMC.1995.523552
Filename :
523552
Link To Document :
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