Study of interconnect vias by the discrete surface integral method

Author

Shi, Hao ; Drewniak, James L.

Author_Institution

Dept. of Electr. Eng., Missouri Univ., Rolla, MO, USA

fYear

195

fDate

14-18 Aug 195

Firstpage

228

Lastpage

233

Abstract

A non-orthogonal time-domain full-wave solver, is developed based on the discrete surface integral (DSI) technique. Closed form expressions are derived for the coefficients used in the leap-frog computation scheme so that the DSI technique can be implemented as a generalised finite-difference procedure. This procedure is employed to investigate the propagation characteristics of a typical interconnect via in printed circuits. The numerically calculated scattering parameters show consistent behavior with measured results. A square via with equal area is also evaluated

Keywords

S-parameters; finite difference time-domain analysis; integral equations; printed circuits; closed form expressions; coefficients; discrete surface integral; discrete surface integral method; finite-difference procedure; interconnect vias; measured results; nonorthogonal time-domain full-wave solver; printed circuits; propagation characteristics; scattering parameters; square via; Electromagnetic waveguides; Finite difference methods; Geometry; Integral equations; Integrated circuit interconnections; Maxwell equations; Printed circuits; Sampling methods; Time domain analysis; Transient analysis;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility, 1995. Symposium Record., 1995 IEEE International Symposium on

Conference_Location

Atlanta, GA

Print_ISBN

0-7803-3608-9

Type

conf

DOI

10.1109/ISEMC.1995.523552

Filename

523552