DocumentCode :
3325979
Title :
A fast-settling high linearity auto gain control for broadband OFDM-based PLC system
Author :
Kuan-I Wu ; Szu-Yao Hung ; Shuo-Hong Hung ; Chen, Charlie Chung-Ping
Author_Institution :
Grad. Inst. of Electron. Eng., Nat. Taiwan Univ., Taipei, Taiwan
fYear :
2015
fDate :
24-27 May 2015
Firstpage :
2852
Lastpage :
2855
Abstract :
A fast-settling high-linearity automatic gain control (AGC) for broadband OFDM-based (Orthogonal Frequency Division Multiplexing) powerline communication (PLC) transceiver is presented in this paper. The high peak-to-average power ratio (PAPR) of OFDM signals makes conventional closed-loop AGCs impractical for the stringent settling-time constraints. A novel AGC algorithm is proposed incorporating with a linear power detector and a charge-redistribution converter to determine the gain of the pseudo-exponential programmable gain amplifier (PGA). Fabricated in 90-nm CMOS technology, the PGA has been measured to exhibit a constant 3-dB bandwidth of 350 MHz with dB-linear gain ranging from -20 to 20 dB. The measured settling time of gain acquisition is less than 0.1 μs, which meets the stringent criteria of short settling time of OFDM-based system. The proposed AGC consumes 3.7 mW through a 1.2-V supply, and occupies 0.07 mm2 active area.
Keywords :
OFDM modulation; automatic gain control; carrier transmission on power lines; transceivers; CMOS technology; bandwidth 350 MHz; broadband OFDM-based PLC transceiver; charge-redistribution converter; closed-loop AGC; fast-settling high-linearity automatic gain control; gain -20 dB to 20 dB; linear power detector; orthogonal frequency division multiplexing; peak-to-average power ratio; power 3.7 mW; powerline communication; pseudoexponential programmable gain amplifier; settling-time constraints; voltage 1.2 V; Bandwidth; CMOS integrated circuits; Computer architecture; Electronics packaging; Gain; Gain control; Microprocessors;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems (ISCAS), 2015 IEEE International Symposium on
Conference_Location :
Lisbon
Type :
conf
DOI :
10.1109/ISCAS.2015.7169281
Filename :
7169281
Link To Document :
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