Parametric dependence of fatigue of electronic adhesives

Author

Gladkov, Alex ; Bar-Cohen, Avram

Author_Institution

Dept. of Mech. Eng., Minnesota Univ., Minneapolis, MN, USA

fYear

1998

fDate

28-30 Sep 1998

Firstpage

116

Lastpage

124

Abstract

Adhesives used in electronic applications are subject to high cyclic shear stresses resulting from differential thermal expansion of the bonded materials. In this study, an attempt has been made to experimentally determine the dependence of the fatigue life of two packaging epoxy adhesives on: temperature, peak cycling stress as a fraction of adhesion strength, and cyclic frequency. Both epoxies were used to bond surfaces of aluminum and silicon. Tensile lap-shear specimens were used

Keywords

adhesion; adhesives; fatigue; mechanical strength; packaging; polymer films; thermal expansion; thermal stresses; Al-Si; adhesion strength; adhesives; aluminum/silicon surface bonding; bonded materials; cyclic frequency; cyclic shear stresses; differential thermal expansion; electronic adhesives; electronic applications; epoxy bonding; fatigue; fatigue life; packaging epoxy adhesives; parametric dependence; peak cycling stress; temperature dependence; tensile lap-shear specimens; Adhesives; Aluminum; Bonding; Electronic packaging thermal management; Fatigue; Frequency; Temperature dependence; Tensile stress; Thermal expansion; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on

Conference_Location

Binghamton, NY

Print_ISBN

0-7803-4934-2

Type

conf

DOI

10.1109/ADHES.1998.742013

Filename

742013