DocumentCode
332658
Title
High frequency interconnections using electrically conductive adhesives
Author
Dernevik, Markus ; Liu, Johan ; Starski, Piotr
Author_Institution
Chalmers Univ. of Technol., Goteborg, Sweden
Volume
3
fYear
1998
fDate
20-22 May 1998
Firstpage
680
Abstract
Results from measurements and simulation of high frequency interconnections are used to obtain an electrical model of the adhesive joint based on the physical parameters involved. Isotropically conductive adhesive joints can be used at microwave frequencies at least up to 30 GHz. Results indicate that the electrical performance of these connections is comparable to that of solder joints
Keywords
adhesives; interconnections; microwave circuits; packaging; 0 to 30 GHz; adhesive joint; electrical model; electrical performance; electrically conductive adhesives; high frequency interconnections; isotropically conductive joints; microwave frequencies; physical parameters; Bonding; Calibration; Circuit testing; Conductive adhesives; Copper; Frequency; Integrated circuit interconnections; Microstrip; Semiconductor device measurement; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwaves and Radar, 1998. MIKON '98., 12th International Conference on
Conference_Location
Krakow
Print_ISBN
83-906662-0-0
Type
conf
DOI
10.1109/MIKON.1998.742803
Filename
742803
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