DocumentCode :
3326701
Title :
Preparation and characterization of polymer -copper composites by electrical explosion of wire
Author :
Aijie Liu ; Huu Bac Luong ; Jin-Chun Kim ; Lizhu Liu
Author_Institution :
Sch. of Mater. Sci. & Eng., Univ. of Ulsan, Ulsan, South Korea
Volume :
1
fYear :
2011
fDate :
22-24 Aug. 2011
Firstpage :
29
Lastpage :
32
Abstract :
In this work, polyaniline - copper (PANI-Cu) and polyaniline/polyacrylic acid - copper (PANI/PAA-Cu) composites were synthesized by electrical explosion of wire (EEW) in the liquid. The PANI and PAA polymers in ethanol were stirred for 24 hrs. and sonicated for 2 hrs. The polymer solutions used as a liquid for explosion process to fabricate the Cu nanoparticle. X-ray diffraction (XRD) results of the composites showed that the Cu was polycrystal. Field emission scanning electron microscope (FE-SEM) was used to observe the microstructure of the composites. The PANI particles were in round shape and covered on the as-prepared Cu nanoparticles. The Cu nanoparticles were spherical and dispersed well in the polymer matrix. Crystalline size of the Cu nanoparticles was about 25nm. The obtained composites were extensively characterized by Fourier Transform Infrared (FTIR) spectroscopy, and electrical measurements.
Keywords :
Fourier transform spectra; X-ray diffraction; copper; crystal microstructure; field emission electron microscopy; filled polymers; infrared spectra; nanocomposites; nanofabrication; nanoparticles; scanning electron microscopy; Cu; Fourier transform infrared spectroscopy; X-ray diffraction; crystalline size; electrical explosion; electrical measurement; field emission scanning electron microscopy; microstructure; nanoparticle; polyaniline-polyacrylic acid-copper composites; polymer solutions; polymer-copper composites; Copper; Dielectrics; Ethanol; Films; Nanoscale devices; Polymers; Composite; Copper nanoparticles; Electrical explosion of wire (EEW); Polyacrylic acid; Polyaniline;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Strategic Technology (IFOST), 2011 6th International Forum on
Conference_Location :
Harbin, Heilongjiang
Print_ISBN :
978-1-4577-0398-0
Type :
conf
DOI :
10.1109/IFOST.2011.6020957
Filename :
6020957
Link To Document :
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