• DocumentCode
    33270
  • Title

    Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC–TSI)

  • Author

    Katti, Guruprasad ; Ho, S.W. ; Li Hong Yu ; Songbai Zhang ; Dutta, Rahul ; Weerasekera, Roshan ; Ka Fai Chang ; Jong-Kai Lin ; Vempati, Srinivasa Rao ; Bhattacharya, Surya

  • Volume
    32
  • Issue
    4
  • fYear
    2015
  • fDate
    Aug. 2015
  • Firstpage
    23
  • Lastpage
    31
  • Abstract
    Editor´s notes: Two-and-a-half-dimensional integration enables high-density interdie connections with low cost. This paper presents a through silicon interposer (TSI) fabrication process and detailed characterization and measurement results of redistribution layers and through silicon vias for low-cost 2.5-D integration.
  • Keywords
    integrated circuit packaging; three-dimensional integrated circuits; high-density interdie connections; low-cost through silicon interposer; redistribution layers; CADCAM; Circuit synthesis; Dielectrics; Fabrication; Integrated circuit manufacture; Microelectronics; Polymers; Low cost Through-Silicon Interposer (TSI); polymer based Cu-RDL technology;
  • fLanguage
    English
  • Journal_Title
    Design & Test, IEEE
  • Publisher
    ieee
  • ISSN
    2168-2356
  • Type

    jour

  • DOI
    10.1109/MDAT.2015.2424429
  • Filename
    7089207
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=33270