Title :
Slicing floorplans with pre-placed modules
Author :
Young, F.Y. ; Wong, D.F.
Author_Institution :
Dept. of Comput. Sci., Texas Univ., Austin, TX, USA
Abstract :
Existing floorplanners that use slicing floorplans are efficient in runtime and yet can pack modules tightly. However, none of them can handle pre-placed modules. In this paper, we extend a well-known slicing floorplanner to handle pre-placed modules. Our main contribution is a novel shape curve computation procedure which can take the positions of the pre-placed modules into consideration. The shape curve computation procedure is used repeatedly during the floorplanning process to fully exploit the shape flexibility of the modules to give a tight packing. Experimental results show that the extended floorplanner performs very well.
Keywords :
VLSI; circuit layout CAD; integrated circuit layout; modules; pre-placed module position; pre-placed modules; shape curve computation procedure; shape flexibility; slicing floorplans; tight module packing; Art; Benchmark testing; Costs; Design methodology; Integrated circuit interconnections; Permission; Runtime; Shape; Very large scale integration;
Conference_Titel :
Computer-Aided Design, 1998. ICCAD 98. Digest of Technical Papers. 1998 IEEE/ACM International Conference on
Conference_Location :
San Jose, CA, USA
Print_ISBN :
1-58113-008-2
DOI :
10.1109/ICCAD.1998.144275