Title :
A high throughput test methodology for MCM substrates
Author :
Kim, Bruce C. ; Keezer, David ; Chatterjee, Abhijit
Author_Institution :
Dept. of Electr. & Comput. Eng., Michigan State Univ., East Lansing, MI, USA
Abstract :
This paper describes a new high throughput test methodology for a new multi-chip module (MCM) substrate. This is based on a new MCM substrate technology which contains interconnects, embedded passive devices, and mixed-signal circuits, currently being developed by the Packaging Research Center at Georgia Tech. The resulting MCM modules are called SLIM (single layer integrated module). In this paper a best methodology for SLIM modules is discussed
Keywords :
integrated circuit interconnections; integrated circuit testing; multichip modules; substrates; MCM modules; MCM substrates; Packaging Research Center; SLIM substrate; embedded passive devices; high throughput test; interconnects; mixed-signal circuits; multichip module substrate; single layer integrated module; Bonding; Circuit testing; Costs; Impedance; Manufacturing; Packaging; Probes; Radio frequency; Throughput; Wire;
Conference_Titel :
Test Conference, 1998. Proceedings., International
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-5093-6
DOI :
10.1109/TEST.1998.743157
