• DocumentCode
    3328498
  • Title

    Keynote Abstract: Alessandro Cremonesi

  • Author

    Cremonesi, A.

  • Author_Institution
    STMicroelectron., Agrate Brianza
  • fYear
    2008
  • fDate
    3-5 Sept. 2008
  • Abstract
    Summary form only given. In his presentation, Alessandro Cremonesi will address the major challenges that the semiconductor industry will be confronted with in the context of the global ecosystem. Convergence is a clear driver for the industry and the applications fuelling the convergence are becoming increasingly complex and the need to guarantee the coexistence of a wider range of applications on a single chip is rendering system-level integration a real challenge. Most of the applications will run on platforms specifically designed for portable products, forcing the industry to reach high levels of miniaturization and high levels of power optimization versus performances in all new designs. At the same time the complexity and the capital investments required to sustain such evolution risk to bring the industry in a slow down area. For this reason new technical and industrial approaches are needed to fuel the growth. On top of "convergence", new promising applications areas for semiconductors are simultaneously appearing at the horizon. Such applications will require the integration of new competences such as bio, optical, mechanical generating new challenges for our industry but also bringing huge new market opportunities of the global ecosystem.
  • Keywords
    investment; risk analysis; semiconductor device manufacture; capital investments; convergence; global ecosystem; industry risk; rendering system-level integration; semiconductor industry; single chip; Biomedical optical imaging; Convergence; Design optimization; Ecosystems; Electronics industry; Fuels; Integrated optics; Investments; Market opportunities; Product design;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Digital System Design Architectures, Methods and Tools, 2008. DSD '08. 11th EUROMICRO Conference on
  • Conference_Location
    Parma
  • Print_ISBN
    978-0-7695-3277-6
  • Type

    conf

  • DOI
    10.1109/DSD.2008.8
  • Filename
    4669210