DocumentCode :
3328912
Title :
High power LED thermal performance test analysis and its research methods
Author :
Hong min Wang ; Haibo Li ; Hua Chen ; Yu Cao
Author_Institution :
Coll. of Autom., Harbin Univ. of Sci. & Technol., Harbin, China
Volume :
1
fYear :
2011
fDate :
22-24 Aug. 2011
Firstpage :
517
Lastpage :
520
Abstract :
High-power LED thermal resistance characteristics, the overall temperature distribution and using heat dissipation method all have significant impacts on the reliability of the LED work but there is no effective measuring method in production practice. In this paper, we use infrared thermal imaging technology to get 1W high power LED transient thermal field map. Through visual means, we can clearly observe the overall high power LED thermal field distribution. Accordingly, the impact of the overall temperature distribution of LED on its thermal design and reliability will be discussed. At the same time, it also proves that the infrared thermal imaging technology can be used as an effective means of high-power LED thermal testing and analysis.
Keywords :
infrared imaging; light emitting diodes; semiconductor device testing; thermal analysis; heat dissipation method; high power LED; power 1 W; thermal field distribution; thermal performance; transient thermal field map; Decision support systems; Heating; Junctions; Light emitting diodes; Packaging; Semiconductor device measurement; TV; High power LED; Infrared thermal imaging; Thermal analysis;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Strategic Technology (IFOST), 2011 6th International Forum on
Conference_Location :
Harbin, Heilongjiang
Print_ISBN :
978-1-4577-0398-0
Type :
conf
DOI :
10.1109/IFOST.2011.6021076
Filename :
6021076
Link To Document :
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