• DocumentCode
    3329637
  • Title

    Numerical simulation of a magnetron plasma sputtering system using VORPAL

  • Author

    Chuandong Zhou ; Stoltz, P.H.

  • Author_Institution
    Tech-X Corp., Boulder, CO, USA
  • fYear
    2010
  • fDate
    20-24 June 2010
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Summary form only given. Three-dimensional numerical simulation is conducted for a magnetron sputtering plasma using the particle in cell code VORPAL. Numerical simulation of sputtering process requires accurate models of nuclear stopping in materials, particle dynamics and self-consistent electromagnetic fields. VORPAL can simulate cold dense plasma sputtering system under many different electromagnetic configurations. The dynamics of both incident particles and sputtered neutral atoms are simulated in VORPAL. The sputtering yield is calculated from a standalone numerical library for a variety of materials that are commonly used in industrial applications. Numerical simulation of the spatial distribution of sputtered atoms resulting from a cold dense magnetron sputtering plasma under externally applied magnetic field and self-consistent electric field is presented.
  • Keywords
    magnetrons; plasma density; plasma simulation; sputtering; VORPAL; cold dense plasma sputtering system; external magnetic field; incident particle dynamics; magnetron plasma sputtering system; nuclear stopping model; particle dynamics; particle-in-cell code; self-consistent electromagnetic field; sputtered atom distribution; three-dimensional numerical simulation; Conducting materials; Electromagnetic fields; Electromagnetic modeling; Magnetic materials; Numerical simulation; Plasma applications; Plasma density; Plasma materials processing; Plasma simulation; Sputtering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Plasma Science, 2010 Abstracts IEEE International Conference on
  • Conference_Location
    Norfolk, VA
  • ISSN
    0730-9244
  • Print_ISBN
    978-1-4244-5474-7
  • Electronic_ISBN
    0730-9244
  • Type

    conf

  • DOI
    10.1109/PLASMA.2010.5534033
  • Filename
    5534033