DocumentCode
3329637
Title
Numerical simulation of a magnetron plasma sputtering system using VORPAL
Author
Chuandong Zhou ; Stoltz, P.H.
Author_Institution
Tech-X Corp., Boulder, CO, USA
fYear
2010
fDate
20-24 June 2010
Firstpage
1
Lastpage
1
Abstract
Summary form only given. Three-dimensional numerical simulation is conducted for a magnetron sputtering plasma using the particle in cell code VORPAL. Numerical simulation of sputtering process requires accurate models of nuclear stopping in materials, particle dynamics and self-consistent electromagnetic fields. VORPAL can simulate cold dense plasma sputtering system under many different electromagnetic configurations. The dynamics of both incident particles and sputtered neutral atoms are simulated in VORPAL. The sputtering yield is calculated from a standalone numerical library for a variety of materials that are commonly used in industrial applications. Numerical simulation of the spatial distribution of sputtered atoms resulting from a cold dense magnetron sputtering plasma under externally applied magnetic field and self-consistent electric field is presented.
Keywords
magnetrons; plasma density; plasma simulation; sputtering; VORPAL; cold dense plasma sputtering system; external magnetic field; incident particle dynamics; magnetron plasma sputtering system; nuclear stopping model; particle dynamics; particle-in-cell code; self-consistent electromagnetic field; sputtered atom distribution; three-dimensional numerical simulation; Conducting materials; Electromagnetic fields; Electromagnetic modeling; Magnetic materials; Numerical simulation; Plasma applications; Plasma density; Plasma materials processing; Plasma simulation; Sputtering;
fLanguage
English
Publisher
ieee
Conference_Titel
Plasma Science, 2010 Abstracts IEEE International Conference on
Conference_Location
Norfolk, VA
ISSN
0730-9244
Print_ISBN
978-1-4244-5474-7
Electronic_ISBN
0730-9244
Type
conf
DOI
10.1109/PLASMA.2010.5534033
Filename
5534033
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