Title :
RF (gigahertz) ATE production testing on wafer: options and tradeoffs
Author :
Gahagan, Dean A.
Author_Institution :
Cascade Microtech Inc., Beaverton, OR, USA
Abstract :
This paper describes the hardware solution tradeoffs in testing RF devices on wafer in a production environment using ATE. The options, which are available today, will be compared with respect to RF measurement integrity and production worthiness
Keywords :
MMIC; automatic test equipment; integrated circuit economics; integrated circuit testing; microwave measurement; production testing; telecommunication equipment testing; ATE; RF measurement integrity; RFIC testing; cabled interface; calibration; direct docking; probe cards; production testing; production worthiness; Assembly; Bandwidth; Chip scale packaging; Integrated circuit packaging; Internet; Production; Radio frequency; Radiofrequency integrated circuits; System testing; Wafer scale integration;
Conference_Titel :
Test Conference, 1999. Proceedings. International
Conference_Location :
Atlantic City, NJ
Print_ISBN :
0-7803-5753-1
DOI :
10.1109/TEST.1999.805760
