Static component interconnect test technology (SCITT) a new technology for assembly testing

Author

Biewenga, Alex ; Hollmann, Henk D L ; De Jong, Frans ; Lousberg, Maurice

Author_Institution

Philips Res. Lab., Eindhoven, Netherlands

fYear

1999

fDate

1999

Firstpage

439

Lastpage

448

Abstract

Modern packaging technology combined with densely populated assemblies requires efficient design for test features. In particular, modern memories with complex interfaces need to be addressed. This paper presents the details of a test technology that makes assembly test more efficient. The method is based on the implementation of XOR and XNOR gates to bypass a functional circuit. It is compatible yet complimentary to boundary-scan. Mathematical proof and simulation results show the effectiveness of this method for detection and diagnosis of assembly faults. Known alternatives are compared for test coverage

Keywords

design for testability; electronic equipment testing; fault diagnosis; integrated circuit interconnections; integrated circuit testing; logic testing; DFT; SCITT; XNOR gates; XOR; assembly faults; assembly testing; boundary scan test; complex interfaces; simulation; static component interconnect test technology; test coverage; test patterns; Assembly; Binary search trees; Circuit faults; Circuit testing; Electronic equipment testing; Fault diagnosis; History; Integrated circuit interconnections; Manufacturing; Packaging;

fLanguage

English

Publisher

ieee

Conference_Titel

Test Conference, 1999. Proceedings. International

Conference_Location

Atlantic City, NJ

ISSN

1089-3539

Print_ISBN

0-7803-5753-1

Type

conf

DOI

10.1109/TEST.1999.805766

Filename

805766