DocumentCode
3330320
Title
Static component interconnection test technology in practice
Author
De Jong, Franciska
Author_Institution
Philips CFT, Philips Res.
fYear
1999
fDate
1999
Firstpage
556
Lastpage
565
Abstract
Static Component Interconnection Test Technology (SCITT) is a new XNOR circuit based technology that is used for board-level interconnection test. SCITT provides an easy test method using simple patterns and results in a high diagnostic resolution. The method is especially suited for SDRAM and other `complex memories´ but can be used for other devices as well. Very little overhead is required. A real silicon implementation is presented and evaluated
Keywords
DRAM chips; SRAM chips; design for testability; fault diagnosis; integrated circuit interconnections; integrated circuit testing; logic testing; FIFO memories; FLASH memories; SDRAM; XNOR circuit; board-level interconnection test; complex memories; diagnostic resolution; patterns; silicon implementation; static component interconnection test; Assembly; Circuit testing; Electronics packaging; Integrated circuit interconnections; Logic testing; Modems; Pins; Prototypes; SDRAM; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1999. Proceedings. International
Conference_Location
Atlantic City, NJ
ISSN
1089-3539
Print_ISBN
0-7803-5753-1
Type
conf
DOI
10.1109/TEST.1999.805780
Filename
805780
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