Title :
Interconnects and packaging of millimeter wave circuits
Author :
Menzel, Wolfgang
Author_Institution :
Microwave Tech., Ulm Univ., Germany
Abstract :
This paper presents a number of aspects relevant for interconnects and packaging of monolithic integrated circuits, possibly combined with hybrid or even waveguide circuits in the millimeter-wave range. Examples of different interconnects and two realized front-ends are demonstrated
Keywords :
MIMIC; hybrid integrated circuits; integrated circuit interconnections; integrated circuit packaging; millimetre wave integrated circuits; EHF; MM-wave ICs; front-ends; hybrid circuits; interconnects; millimeter wave circuits; monolithic integrated circuits; packaging; waveguide circuits; Assembly; Conducting materials; Costs; Integrated circuit interconnections; Integrated circuit packaging; Millimeter wave circuits; Packaging machines; Semiconductor materials; Thermal conductivity; Thermal expansion;
Conference_Titel :
Millimeter Waves, 1997 Topical Symposium on
Conference_Location :
Kanagawa
Print_ISBN :
0-7803-3887-1
DOI :
10.1109/TSMW.1997.702444
