DocumentCode
3330528
Title
The analysis of measurement methods for high power LED thermal resistance
Author
Hongmin Wang ; Jing Dong ; Zhili Liu ; BingRu Liang
Author_Institution
Harbin Univ. of Sci. & Technol., Harbin, China
Volume
2
fYear
2011
fDate
22-24 Aug. 2011
Firstpage
867
Lastpage
870
Abstract
With the development of high power LED technology, junction temperature as a key factor constrains the performance and the service life of LED, and the main parameter of junction temperature is thermal resistance. Therefore, how to measure the thermal resistance of high power LED quickly and accurately plays an important part in improving the performance and the service life of LED. Based on the study of high power LED thermal resistance and its basic measurement principle, this paper provides an analysis of the different measurement methods for thermal resistance, including of infrared thermal imaging method, spectra method, electrical parameters method, and so on, then compares and analyses their merits and shortcomings, applicable areas and improvement measures that provide the reliable basis for measuring the thermal resistance of high power LED.
Keywords
infrared imaging; light emitting diodes; thermal resistance; thermal resistance measurement; LED performance improvement; LED service life improvement; electrical parameter method; high power LED thermal resistance measurement method; infrared thermal imaging method; junction temperature; spectra method; Electrical resistance measurement; Junctions; Light emitting diodes; Semiconductor device measurement; Temperature measurement; Temperature sensors; Thermal resistance; high power LED; junction temperature; thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Strategic Technology (IFOST), 2011 6th International Forum on
Conference_Location
Harbin, Heilongjiang
Print_ISBN
978-1-4577-0398-0
Type
conf
DOI
10.1109/IFOST.2011.6021158
Filename
6021158
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