• DocumentCode
    3330798
  • Title

    Inorganic fillers for corona endurance enhancement of selected polymers

  • Author

    Horwath, J. ; Schweickart, D.

  • Author_Institution
    US Air Force Res. Lab., USA
  • fYear
    2002
  • fDate
    30 June-3 July 2002
  • Firstpage
    644
  • Lastpage
    647
  • Abstract
    In high voltage applications, polymer insulation can be exposed to very high electrical field stress, resulting in long term exposure to corona. The electrical field stress may be much below dielectric breakdown threshold. Eventually the exposure to corona can lead to failure of the high voltage component. Nanometer sized inorganic fillers are increasingly used as reinforcing materials for mechanical or thermal property improvement of polymers. Improvements in mechanical modulus or heat deflection temperature are often realized. These fillers may also increase some electrical properties such as corona endurance in polymers. Polyhedral oligomeric silsesquioxane (POSS) loaded polymers are tested for corona endurance. POSS is a synthesized silicon based cage structure with an intermediate oxidation between SiO and SiO2. Results suggest at least a five times improvement in ac corona. lifetime of selected POSS-polymer composites.
  • Keywords
    corona; insulation testing; organic insulating materials; polymers; dielectric breakdown threshold; electrical field stress; heat deflection temperature; high voltage component failure; long term corona exposure; mechanical property improvement; nanometer sized inorganic fillers; polyhedral oligomeric silsesquioxane; polymer insulation; reinforcing materials; thermal property improvement; Corona; Dielectric breakdown; Dielectric materials; Dielectrics and electrical insulation; Inorganic materials; Lead; Plastic insulation; Polymers; Thermal stresses; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Power Modulator Symposium, 2002 and 2002 High-Voltage Workshop. Conference Record of the Twenty-Fifth International
  • ISSN
    1076-8467
  • Print_ISBN
    0-7803-7540-8
  • Type

    conf

  • DOI
    10.1109/MODSYM.2002.1189560
  • Filename
    1189560