Title :
SLACP: A Novel Link-Layer Protocol for Wireless WANs
Author :
Astuti, Davide ; Nyrhinen, Aki ; Jarvinen, Ilpo ; Kojo, Markku
Author_Institution :
Dept. of Comput. Sci., Helsinki Univ., Helsinki
Abstract :
In this paper, we discuss the design details of a TCP/IP- friendly link-layer protocol with novel design to improve TCP performance on network paths involving a Wireless Wide-Area Network (WWAN) link. Our link layer protocol utilizes a new hybrid error-recovery mechanism combining Automatic Repeat reQuests (ARQ) and Forward Error Correction (FEC) in a way that keeps the residual packet-error rate at a very low level and minimizes the additional delay due to ARQ at the same time. The protocol supports several QoS classes by implementing several logical channels over a single physical link and by allowing each channel to be configured with QoS parameters and error control strategy that best suit to the IP traffic directed over the channel. We analyze the error recovery behavior of the protocol using packet traces from our experiments with the real implementation of the protocol and evaluate the protocol performance and the effectiveness of the QoS support in emulated wireless link environments. The results show significant TCP performance improvement and that the QoS approach supports delay-sensitive traffic effectively.
Keywords :
automatic repeat request; forward error correction; transport protocols; wide area networks; wireless LAN; SLACP; TCP/IP; automatic repeat requests; delay-sensitive traffic; forward error correction; hybrid error-recovery mechanism; link-layer protocol; network paths; wireless WAN; Added delay; Artificial satellites; Automatic repeat request; Computer science; Delay effects; Electronic mail; Error correction; Forward error correction; Traffic control; Wireless application protocol; ARQ; FEC; Link-Layer protocols; QoS; TCP performance; TCP/IP; Wireless Networks;
Conference_Titel :
Networking, 2008. ICN 2008. Seventh International Conference on
Conference_Location :
Cancun
Print_ISBN :
978-0-7695-3106-9
Electronic_ISBN :
978-0-7695-3106-9
DOI :
10.1109/ICN.2008.113