DocumentCode
333123
Title
Interface healing between remaining patella and patellar tendon after partial patellectomy-an experimental study in rabbits
Author
Qin, L. ; Leung, K.S. ; Chan, C.W. ; Fu, L.K. ; Rosier, R.N.
Author_Institution
Musculo-Skeletal Res. Lab., Chinese Univ. of Hong Kong, Shatin, Hong Kong
Volume
5
fYear
1998
fDate
28 Oct-1 Nov 1998
Firstpage
2497
Abstract
The authors studied the radiographic patellar tendon calcification and evaluated the histology of the healing interface between patellar tendon and the remaining patella after partial patellectomy in 24 rabbits. Specimens were harvested at 8, 12 and 24 weeks post-operatively (n=8). Histological observation demonstrated that all healing interfaces between patellar tendon and patella were structurally overbridged by scar tissue. The structure incorporation of scar tissue with articular cartilage occurred earlier than with the bone interface. The radiographic patellar tendon calcification next to the healing interface was in fact trabecular bone outgrowth histologically, resulting in an enlargement of the remaining patellar in length with healing over time. Metaplasia of the scar tissue observed next to the healing interface of remaining patellar articular cartilage and the outgrowth of trabecular bone from the remaining patella with healing over time may increase the articular surface of the remaining patella after partial patellectomy
Keywords
diagnostic radiography; orthopaedics; surgery; 8 to 24 w; articular cartilage; bone interface; healing interface histology; metaplasia; partial patellectomy; patella; patellar tendon; radiographic patellar tendon calcification; scar tissue; structurally overbridged interfaces; structure incorporation; tendon calcification; trabecular bone outgrowth; Analysis of variance; Cancellous bone; Diagnostic radiography; Knee; Laboratories; Orthopedic surgery; Rabbits; Surface cracks; Tendons; X-ray imaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society, 1998. Proceedings of the 20th Annual International Conference of the IEEE
Conference_Location
Hong Kong
ISSN
1094-687X
Print_ISBN
0-7803-5164-9
Type
conf
DOI
10.1109/IEMBS.1998.744949
Filename
744949
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