Diagnostic techniques for the IBM S/390 600 MHz G5 microprocessor

Author

Song, Peilin ; Motika, Franco ; Knebel, Dan ; Rizzolo, Rick ; Kusko, Mary ; Lee, Julie ; McManus, Moyra

Author_Institution

IBM Corp., Poughkeepsie, NY, USA

fYear

1999

fDate

1999

Firstpage

1073

Lastpage

1082

Abstract

This paper describes strategies and techniques used to diagnose failures in the IBM 600 MHz G5 (Generation 5) CMOS microprocessor and associated cache chips. Time-to-market pressure demands quick diagnostic turnaround time while the complexity, density, cycle time, and technology issues of the hardware increase the difficulty of diagnosis. Since G5 first silicon, intense diagnostics and physical failure analysis (PFA) have successfully identified the root cause of many failures, including examples of process, design, and random manufacturing defects. This success is attributed to the three techniques described in this paper. For each technique, an example is presented to demonstrate its effectiveness

Keywords

CMOS digital integrated circuits; VLSI; automatic testing; failure analysis; fault diagnosis; integrated circuit testing; logic testing; microprocessor chips; 600 MHz; AC scan fails; CMOS microprocessor; G5 diagnostics; G5 microprocessor; IBM S/390; MCM; PICA; TestBench; VLSI; cache chips; complexity; cycle time; density; diagnostic turnaround time; pattern test fails; random manufacturing defects; time-to-market; transient failure analysis; Failure analysis; Fault diagnosis; Hardware; Logic testing; Manufacturing processes; Microprocessors; Silicon; Software testing; Time to market; Virtual manufacturing;

fLanguage

English

Publisher

ieee

Conference_Titel

Test Conference, 1999. Proceedings. International

Conference_Location

Atlantic City, NJ

ISSN

1089-3539

Print_ISBN

0-7803-5753-1

Type

conf

DOI

10.1109/TEST.1999.805841

Filename

805841