DocumentCode :
3331566
Title :
A novel electrostatic vertical comb actuator fabricated on [111] silicon wafer
Author :
Chu, Chien Cheng ; Tsai, Julius U. ; Hsieh, Jerwei ; Fang, Weileun
Author_Institution :
Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
fYear :
2003
fDate :
19-23 Jan. 2003
Firstpage :
56
Lastpage :
59
Abstract :
In this study, a novel electrostatic vertical comb actuator (VCA) is designed and fabricated on a [111] silicon substrate. The BELST process was exploited to fabricate the proposed VCA. Three advantages for this VCA can be observed. Firstly, through some exquisite design the fabrication process has no critical alignment and bonding problems. Secondly, the relative vertical position between the moving and the stationary finger can be adjusted freely to optimize the performance of the VCA. Thirdly, both the large mirror structure and trimmed torsional spring are available through this process. Thus improved performance regarding enlarged traveling distance with reduced driving voltage can be obtained. According to the static test, this VCA can achieve optical scanning angle near 5 degree when driven at 90 V Moreover in the dynamic test, this actuator can deliver a significant output when driven near 4.1 kHz.
Keywords :
electrostatic actuators; silicon; 4.1 kHz; 90 V; BELST process; Si; VCA; electrostatic vertical comb actuator; mirror structure; trimmed torsional spring; Bonding; Electrostatic actuators; Fabrication; Fingers; Mirrors; Process design; Silicon; Springs; Testing; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 2003. MEMS-03 Kyoto. IEEE The Sixteenth Annual International Conference on
ISSN :
1084-6999
Print_ISBN :
0-7803-7744-3
Type :
conf
DOI :
10.1109/MEMSYS.2003.1189686
Filename :
1189686
Link To Document :
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