Title :
A 16 GHz fast RISC engine using GaAs/AlGaAs and SiGe HBT technology
Author :
Steidl, Stefan ; Carlough, S. ; Ernest, M. ; Garg, A. ; Kraft, R. ; McDonald, J.F.
Author_Institution :
Center for Integrated Electron., Rensselaer Polytech. Inst., Troy, NY, USA
Abstract :
Wafer Scale Hybrid Packages (WSHPs) or MultiChip Modules (MCMs) have provided a breakthrough in system packaging for high clock rate systems. Based on this technology a 2 GHz Fast RISC demonstration integer-only computational engine has been designed, and is submitted for fabrication. This design involved use of Heterojunction Bipolar Transistors (HBTs) in the GaAs/AlGaAs materials system. This paper reviews some of the schemes used in that design and shows how there are actually several paths using advanced GaAs/AlGaAs and SiGe HBT technology to create similar systems that can actually run 8 times faster. Some of the challenges facing the architect and chip designer are discussed
Keywords :
Ge-Si alloys; III-V semiconductors; aluminium compounds; bipolar digital integrated circuits; gallium arsenide; heterojunction bipolar transistors; integrated circuit design; integrated circuit packaging; microprocessor chips; multichip modules; reduced instruction set computing; semiconductor materials; wafer-scale integration; 2 GHz; GaAs-AlGaAs; HBT technology; SiGe; chip design; fast RISC engine; high clock rate systems; integer-only computational engine; multichip modules; system packaging; wafer scale hybrid packages; Clocks; Engines; Fabrication; Gallium arsenide; Germanium silicon alloys; Heterojunction bipolar transistors; Multichip modules; Packaging; Reduced instruction set computing; Silicon germanium;
Conference_Titel :
Innovative Systems in Silicon, 1997. Proceedings., Second Annual IEEE International Conference on
Conference_Location :
Austin, TX
Print_ISBN :
0-7803-4276-3
DOI :
10.1109/ICISS.1997.630248
