• DocumentCode
    3332608
  • Title

    Manufacturable low-power latches for standard tied-double-gate FinFET technologies

  • Author

    Tawfik, Sherif A. ; Kursun, Volkan

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Univ. of Wisconsin-Madison, Madison, WI, USA
  • fYear
    2009
  • fDate
    2-5 Aug. 2009
  • Firstpage
    471
  • Lastpage
    474
  • Abstract
    A low-power manufacturable multi-threshold voltage (multi-Vth) brute force latch based on gate-drain/source overlap engineering in standard tied-gate FinFET technologies is proposed in this paper. Various tied-gate FinFET latch design options are evaluated for active mode power consumption, propagation delay, setup time, leakage power consumption, and static noise margin. With the proposed latch based on gate overlap engineering, the total active mode power consumption, the clock power, and the average leakage power are reduced by up to 62%, 21%, and 45%, respectively, while maintaining similar speed and data stability as compared to the standard circuits in a 32 nm symmetric tied-double-gate FinFET technology.
  • Keywords
    MOSFET; flip-flops; low-power electronics; active mode power consumption; average leakage power; brute force latch; gate-drain-source overlap engineering; leakage power consumption; low-power manufacturable multithreshold voltage; manufacturable low-power latches; propagation delay; size 32 nm; standard tied-double-gate FinFET technologies; static noise margin; Active noise reduction; Circuit noise; Energy consumption; FinFETs; Latches; Power engineering and energy; Propagation delay; Pulp manufacturing; Standards; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems, 2009. MWSCAS '09. 52nd IEEE International Midwest Symposium on
  • Conference_Location
    Cancun
  • ISSN
    1548-3746
  • Print_ISBN
    978-1-4244-4479-3
  • Electronic_ISBN
    1548-3746
  • Type

    conf

  • DOI
    10.1109/MWSCAS.2009.5236052
  • Filename
    5236052