DocumentCode
3332608
Title
Manufacturable low-power latches for standard tied-double-gate FinFET technologies
Author
Tawfik, Sherif A. ; Kursun, Volkan
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Wisconsin-Madison, Madison, WI, USA
fYear
2009
fDate
2-5 Aug. 2009
Firstpage
471
Lastpage
474
Abstract
A low-power manufacturable multi-threshold voltage (multi-Vth) brute force latch based on gate-drain/source overlap engineering in standard tied-gate FinFET technologies is proposed in this paper. Various tied-gate FinFET latch design options are evaluated for active mode power consumption, propagation delay, setup time, leakage power consumption, and static noise margin. With the proposed latch based on gate overlap engineering, the total active mode power consumption, the clock power, and the average leakage power are reduced by up to 62%, 21%, and 45%, respectively, while maintaining similar speed and data stability as compared to the standard circuits in a 32 nm symmetric tied-double-gate FinFET technology.
Keywords
MOSFET; flip-flops; low-power electronics; active mode power consumption; average leakage power; brute force latch; gate-drain-source overlap engineering; leakage power consumption; low-power manufacturable multithreshold voltage; manufacturable low-power latches; propagation delay; size 32 nm; standard tied-double-gate FinFET technologies; static noise margin; Active noise reduction; Circuit noise; Energy consumption; FinFETs; Latches; Power engineering and energy; Propagation delay; Pulp manufacturing; Standards; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems, 2009. MWSCAS '09. 52nd IEEE International Midwest Symposium on
Conference_Location
Cancun
ISSN
1548-3746
Print_ISBN
978-1-4244-4479-3
Electronic_ISBN
1548-3746
Type
conf
DOI
10.1109/MWSCAS.2009.5236052
Filename
5236052
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