Three-dimensional integration technology for real time micro-vision system

Author

Kurino, H. ; Matsumoto, T. ; Yu, K.-H. ; Miyakawa, N. ; Itani, H. ; Tsukamoto, H. ; Koyanagi, M.

Author_Institution

Dept. of Machine Intelligence & Syst. Eng., Tohoku Univ., Sendai, Japan

fYear

1997

fDate

8-10 Oct 1997

Firstpage

203

Lastpage

212

Abstract

It becomes possible to achieve the real time micro-vision system with extremely high image processing speed if three-dimensional LSI comes into reality because a higher level of parallel processing can be performed in three-dimensional LSI. Then, we have proposed a new three-dimensional integration technology for such real time micro-vision system with high image processing speed. Several key technologies for three-dimensional integration such as formation of buried interconnection and micro-bump, wafer thinning, wafer alignment and wafer bonding have been developed

Keywords

computer vision; integrated circuit technology; integrated optoelectronics; large scale integration; parallel processing; real-time systems; LSI; buried interconnection; image processing; micro-bump; parallel processing; real time micro-vision system; three-dimensional integration technology; wafer alignment; wafer bonding; wafer thinning; Image converters; Image processing; Integrated circuit interconnections; Large scale integration; Latches; Parallel processing; Pipelines; Real time systems; Sensor arrays; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

Innovative Systems in Silicon, 1997. Proceedings., Second Annual IEEE International Conference on

Conference_Location

Austin, TX

ISSN

1094-7116

Print_ISBN

0-7803-4276-3

Type

conf

DOI

10.1109/ICISS.1997.630262

Filename

630262